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Zepoxy REH 953 U

Zepoxy RER AW106 and Zepoxy REH 953U is a two-component epoxy adhesive system comprising of resin Zepoxy RER AW106 and hardener Zepoxy REH 953U. The adhesive is moderately reactive and cures at temper... read more

Zepoxy REH 120

Zepoxy REH 120 is a high viscosity reactive polyamide used as curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 to produce room temperature curable adhesives and coatings. ... read more

Zepoxy REH 140

Zepoxy REH 140 is a medium viscosity reactive polyamide with high imidazoline content used as a curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to ... read more

Zepoxy REH 125

Zepoxy REH 125 is a medium viscosity reactive polyamide with high imidazoline content used as a curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to ... read more

Zepoxy REH 115

Zepoxy REH 115 is high viscosity reactive polyamide curing agent with high imidazole content for Epoxy Resin to be used in various adhesive and coating applications. read more

Zepoxy REH 145

Zepoxy REH 145 / 145M are medium viscosity reactive polyamides with high imidazoline content used as curing agents for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X ... read more

Zepoxy REH 145 M

Zepoxy REH 145M / 145 are medium viscosity reactive polyamides with high imidazoline content used as curing agents for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X ... read more

Zepoxy REH 147

Zepoxy REH 147 is a medium viscosity reactive polyamide used as curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to produce room temperature curable... read more

Zepoxy REH 115 X 70

Zepoxy REH 115 X70 is a low viscosity solvent-based reactive polyamide curing agent for epoxy resin to be used in various applications. read more

Zepoxy REH 115 MX B 70

Zepoxy REH 115 MX B70 is a specially modified polyamide solution with excellent curing in high humidity/low temperature environments and excellent adhesion to damp substrates. It can be used with RER ... read more